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• Source-measure unit (SMU) based WLR systems
• Flexible architecture accommodates your changing needs
• Configurations can include from 2 to 44 source-measure channels
• Comprehensive JEDEC-compliant test suite
• Optimized for both emerging and mature technologies
• Supports both sequential and parallel testing
• Fully automatic single-site and multi-site capability
• Compatible with all popular wafer probe stations
• Real-time plotting and wafer mapping

Keithley has taken the power of its ACS systems and focused it on wafer level reliability (WLR) testing to create its ACS-WLR Integrated Test Systems. The result - you can produce lifetime predictions from two to five times faster than you can with conventional WLR test solutions, allowing you to accelerate your technology development, process integration, and process monitoring for faster time to market.

ACS-WLR systems offer comprehensive single- and parallel-device WLR testing capability. They are configured with our innovative Series 2600A System SourceMeter® instruments that provide the systems with unmatched testing speed and accuracy via an SMU-per-pin architecture. A single 2600A dual-channel source-measure unit (SMU) is suitable for single-device reliability testing. The smallest configurations require only a single 2600A dual-channel SMU; however, most system configurations support from 8 to 40 SMUs in a single rack for true parallel WLR characterization applications. The 2600A SMUs allow the ACS-WLR architecture to supply both high voltage (200V) and high current (1.5A) sourcing and measurement to every test structure pad. This maximizes test flexibility, so you don’t need one solution for gate oxide integrity and a different system for metal interconnect reliability. Whether you are testing thick oxide or advanced gate stacks, you can characterize lifetime acceleration with a single touchdown every S2600A SMU can be programmed independently so that splits can be performed on a single structure.

• Device Reliability
•     HCI
•     NBTI
•     PBTI
• Gate Oxide Integrity
•     TDDB
•     V_RAMP
•     J_RAMP
• Metal Interconnect
•     Isothermal EM
•     Poly Heater
•     Constant Current
•     ILD TDDB